Performance of micro-grinding pins with different bonding while micro-grinding Si<SUB align="right">3N<SUB align="right">4

Abstract

Selection of a grinding tool with proper specification and bond material is a major challenge in the field of micro/grinding process. In this fundamental study, four different types of diamond micro-grinding pins were used. The bond types were varied and their effects on the grinding forces and surface roughness were analysed. In the experimental study, the microtopography of the grinding tool, cutting speed and depth of cut were considered as input process parameters as well as the bond. The results revealed that forces and surface roughness are highly influenced by the tool topography. Using vitrified micro-grinding pin resulted in lower grinding forces (up to 40%) than other types. The tool wear increased with the material removal when using metal bonded grinding tool. Nevertheless, vitrified grinding tool was exposed to the self-sharpening - lowering the forces. The hybrid bond tool was the most stable tool during the grinding process - keeping the forces and surface roughness almost in the same order over the time, despite higher induced cutting forces.