Abstract
ABSTRACT The flattened micro heat pipes, having a thickness of 2.0,1.6 and 1.2 mm, and a micro heat pipe, having a 3 mm OD, are being manufactured and tested. This work involves the modeling of a micro heat pipe operating under steady state conditions. A one-dimensional mathematical model is developed and solved numerically. As a result of the test, it was found that the flattened micro heat pipes would be to cool micro-electronic chip and experimental data shows relatively good agreement with the model predictions.
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