Performance of back supportless CCDs for the NeXT mission

Abstract

New X-ray Telescope (NeXT) will be the next Japanese X-ray astronomical satellite, which will be launched around 2010. A multilayer super mirror will give NeXT a large effective area across the 0.1–80 keV band. This wide bandpass requires a focal plane detector that is also sensitive along the entire energy band. As the focal plane detector for NeXT, we have been developing a Wideband hybrid X-ray Imager (WXI) consisting of X-ray CCDs and pixelized CdTe detector. The X-ray CCD of the WXI is required to maintain high quantum efficiency up to the high-energy band while allowing hard X-rays to pass undetected through the depletion (sensitive) layer. In order to meet these requirements, we have been developing a back supportless CCD (BS-CCD) which has a thick depletion layer, a thinned Si wafer and a back supportless structure. As the first step, we manufactured a test model of BS-CCD in order to (1) learn the handling and thinning process and (2) confirm that there is no change of the performance. For the mechanical strength and the safe handling of the wafer, we decided to thin the wafer to ∼ 200 μ m . We verified the thickness of the depletion layer and wafer of the BS-CCD to be about 70 and 190 μ m , respectively. The energy resolution at 5.9 keV of 144 eV and the read-out noise of 7 electrons (rms) are equal to those of an un-thinned CCD, hence, we confirmed that our thinning process has no effect on the performance.