Abstract
This study proposes a novel design having dense fins with lesser thickness at the upper layer and comparatively spare fins with greater thickness in the lower layer to further improve the overall thermal performance of a double-layer microchannel heat sink. The design can effectively direct more low temperature fluid flow toward the lower layer to improve heat transfer while the sparse fin structure at low layer can ease pressure drop penalty. At the same time, the thicker fins at the lower layer ensure higher fin efficiency to facilitate high heat transfer. Parametric and detailed analysis is conducted for the proposed double-layer microchannel heat sink in comparison with the traditional one. After optimization, the thermal resistance of the proposed double-layer microchannel heat sink at the same pumping power is found to be reduced by 9.42% when compared to the traditional double-layer microchannel heat sink. Yet at the same Reynolds number, the Nusselt number of the proposed design exceeds the traditional value by 13%.
Highlights
With a rapid surge in the performance of electronic products, device size has shrunk appreciably and power density rose considerably over time
At the same time, when water is used as the cooling medium, the laminar flow normally prevails within the range of Re ≈ 2000 [4,5,6,7] which falls within typical operational range of microchannel heat sinks (MHS)
Compared with the traditional double-layer microchannel heat sink (DMHS) with rectangular fins, the results show that DL-CPFHS has lower thermal resistance; the greater the pump power, the more obvious the improvement
Summary
With a rapid surge in the performance of electronic products, device size has shrunk appreciably and power density rose considerably over time. Some studies have attempted to improve the heat dissipation performance by changing the microchannel structure into multilayer MHSs. Sakanova et al [42] used the computational fluid dynamics (CFD) method to optimize and to compare the traditional DMHS for the double-layer microchannel heat sink with a Cu interlayer. Shen et al [60,61,62] proposed a new DMHS with staggered flow alternation structure (SFAS) They simulated the effect of alternate positions and numbers in the channel on the thermal performance, and found that the pressure drop loss of the two-layer microchannel heat sink with the alternating rectangular fin is lower, and the overall thermal performance is better. By considering the pumping power and thermal resistance simultaneously, the response surface method is used to further optimize the proposed design and minimize thermal resistance under certain constraints
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