Abstract
Thin Ru21Zr64Si15 films deposited on Si substrates by radio frequency reactive magnetron sputtering are studied and evaluated as diffusion barriers for Cu metallization. Cu/Ru21Zr64Si15/Si and Cu/Zr67Si33/Si structure samples are prepared under the same procedures for comparison. The thermal stability, phase formation, surface morphology and atomic depth profile of the Cu/Ru21Zr64Si15/Si and Cu/Zr67Si33/Si structures before and after annealing at different temperatures are investigated. In conjunction with these analyses, the Cu/Ru21Zr64Si15/Si contact system shows high thermal stability at least up to 650°C. The results obtained reveal that the incorporation of Ru atoms into the Zr67Si33 barrier layer is shown to be beneficial for improving the thermal stability of the Cu/barrier/Si contact system.
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