Abstract
The coating characteristics of an extended magnetron sputtering cathode which allows for the transfer of sputtered material from the target to the substrate with an improved efficiency are described in this paper. The cathode allows for the holding of target bars such that the sputtering surface forms a V-shaped trough which, coupled with a small (1.75 cm) separation between the target and the substrate, allows for very efficient transport of material from the target to the substrate. A further aspect of the shape is a narrow deposition zone (7 cm) compared with that of|planar magnetron|sources. Thez.sfnc;cathode achieves aluminum deposition rates of 1.75 μm min −1 in this narrow deposition zone. Furthermore, the appropriate placement of electron capture electrodes permits the achievement of these rates at relatively low substrate heat fluxes. The combined high rate and narrow deposition zone result in a substantially high productivity of the sputtering machine, which is quantitatively described in this paper.
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