Performance and reliability assessment of source work function engineered charge plasma based Ti/HfO2/Al2O3/Ge, double gate TFET

Abstract

The Tunnel Field Effect Transistor (TFET) often suffers from low ON current (I ON), charge traps, and thermal variability, which limits its performance and reliability. To address these issues, the source work function engineered Ge Charge Plasma Double Gate Tunnel Field Effect Transistor (CP-DGTFET) device structure with HfO2/Al2O3 bilayer gate dielectric is designed and investigated using numerical TCAD simulations. The proposed Ti/HfO2/Al2O3/Ge CP-DGTFET device structure showed excellent DC characteristics with exceptional I ON, I ON/I OFF ratio, and minimal sub-threshold swing (S) of ∼3.04 × 10−4 A μm−1, ∼1.2 × 1010, and ∼3.4 mV/dec, respectively. Furthermore, the device’s analog characteristics displayed good transconductance, cut-off frequency, and gain bandwidth product of ∼0.75 mS/μm, ∼0.97 THz, and ∼102 GHz, respectively. Moreover, the charge trap exploration divulges that positive ITCs can enhance device performance, whereas negative ITCs can adversely impact the electrical characteristics of CP-DGTFET. Additionally, the temperature-dependent analysis showed that the OFF-state leakage current increases from ∼1.7 × 10−15 A μm−1 to 2.4 × 10−10 A μm−1 with temperature fluctuations from 275 K to 375 K. Overall, the work function-engineered CP-based Ti/HfO2/Al2O3/Ge DGTFET device structure shows great potential for improving the performance and reliability of Ge TFET technology.