Performance Analysis of Square and Triangular CNT Bundle Interconnects Driven by CNTFET-Based Inverters

Abstract

This paper proposes the use of triangular cross-sectioned CNT (T-CNT) bundle interconnects for VLSI circuits. The geometry of T-CNT bundles has the advantage of offering least possible crosstalk between adjacent interconnects. The performance factors like propagation delay, power dissipated, crosstalk delay, crosstalk power, On/OFF time of the output waveforms and the output waveform swing are analyzed and compared with traditionally used square CNT (S-CNT) bundle interconnects. Results show that T-CNT bundles offer lesser power dissipation at longer lengths >1000 µm. Also the crosstalk delay is lesser for T-CNT bundles compared to S-CNT bundles. Both the types of interconnects are driven by GAA CNTFET based inverter circuits.