Abstract
Percolation behavior of a copper (Cu) layer on a multi-walled carbon nanotube/polypropylene (MWCNT/PP) nanocomposite substrate after laser-direct-structuring (LDS) and subsequent autocatalytic Cu deposition (ACD) is presented. The inverse sheet resistance showed percolation type dependence on the area fraction of Cu on MWCNT/PP measured by digital image processing of specimen photos.
Highlights
Electronic appliances on plastic substrates are widely utilized in various elds like the automotive industry, medicine and consumer electronics.[1,2,3,4] Fabrication of the monolithic integrated electric circuits on plastics is necessary for those application areas
The jump over several orders of magnitude of inverse sheet resistance observed at the area fraction of z47% suggested that percolation effect of electrically conductive Cu layer on the insulating multi-walled carbon nanotube (MWCNT)/PP nanocomposite substrate was observed
The MWCNT/PP nanocomposite substrate was patterned by the LDS technique
Summary
Mindaugas Gedvilas, *a Karolis Ratautas,a Aldona Jagminiene,a Ina Stankeviciene,a Nello Li Pira,b Stefano Sinopoli,c Elif Kacar,de Eugenijus Norkusa and Gediminas Raciukaitisa. Percolation behavior of a copper (Cu) layer on a multi-walled carbon nanotube/polypropylene (MWCNT/ PP) nanocomposite substrate after laser-direct-structuring (LDS) and subsequent autocatalytic Cu deposition (ACD) is presented. The inverse sheet resistance showed percolation type dependence on the area fraction of Cu on MWCNT/PP measured by digital image processing of specimen photos
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