Peltier-effect module for highly localized temperature manipulations

Abstract

A Peltier-effect module suitable for applications that require manipulation of the temperature (cooling or heating) of microsized subjects or at a highly localized spot was developed. The module was constructed from a commercial electronic refrigeration device based on the Peltier effect with an array of microprobes attached to its top surface. The microprobes were fabricated using the LIGA (German acronym for lithographie, galvanoformung, abformung) process—one of the microelectromechanical systems technologies. The 1000-μm-tall microprobes were fabricated on a titanium plate and then bonded onto the top surface of a commercial Peltier device. When an electrical current was supplied to the Peltier device, the top surface (with microprobes) of the device was cooled and the other side was heated. Heat was conducted from a microsample on the tip of microprobe to the top surface of the Peltier device. A dynamic model of the module was developed and numerical simulation studies were conducted. The prototype module was tested and the experimental results matched well with those predicted by the numerical simulations. The maximum difference between the temperature of a microsample and that at the surface of the Peltier device was approximately 1 °C.