Abstract
AbstractSiO2 films have been prepared from tetraisocyanatesilane (TICS, Si(NCO)4) by using a conventional capacitively coupled RF(13.56MHz) plasma-enhanced CVD method. The films show poor water resistivity, which originates in inclusion of NCO in the films. This has been improved by mixing O2 to the source gas. SiO:F films have been prepared by mixing SiF4. The film with F concentration of 6at.% has shown dielectric constant of 3.3, resistivity of 3.6×1015Ωcm at 1MV/cm and break-down electric field of 7.7MV/cm. Infrared spectrum of the film have contained no noticeable OH peak even after exposing to the air for 2 weeks.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Paper version not known
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
