Pd-free surface activation technique for ABS surface metallisation

Abstract

An environmentally friendly surface etching and Pd free activation technique for acrylonitrile–butadiene–styrene (ABS) surface metallisation was investigated. With surface etching, NiSO4 absorption and NaBH4 reduction, nickel particles were deposited on the ABS surface as a catalyst replacement for palladium catalyst to achieve surface metallisation. After the electroless plating, a uniform copper film was electrodeposited on the ABS surface. The effects of NiSO4 concentration, NaBH4 concentration, reduction temperature and reduction time on the adhesion strength between the ABS surface and the electroless copper film were investigated. The adhesion strengths between electroless copper and ABS substrate reached 0·72 kN m−1, and indicated that this surface activation technique was a feasible and cost effective method for ABS surface metallisation.