PCB thermal reliability characteristics analysis under ambient temperature

Abstract

PCB is an important component for electronic devices – Mechanical connections and electrical transmission, thermal failure is its main failure mode, the heat flow analysis and thermal design is the basis and premise to improve thermal characteristics of PCBs. In this paper, based on the principles of fluid mechanics, using the finite volume method, the thermal characteristics of the PCB is modeled, and we obtain the maximum junction temperature of the PCB, PCB’s thermal distribution and effect of different ambient temperatures on the PCB thermal characteristics. The study provides a theoretical basis for the PCB thermal design.