Abstract
Ferroelectric thin film semiconductor memories have the potential to dominate world memory markets. Technical developments in the next five years will determine whether ferroelectric thin film memory technology will be the basis of an annual $30 billion market or will be relegated to only niche market status. Among the technologies that ferroelectric random access memories (FERAMs) could replace are electrically erasable programmable read only memories (EEPROMs), Flash nonvolatile memories (FLASH), and dynamic random access memories (DRAMs). Ferroelectric thin film nonvolatile memory technology will be emphasized in this chapter. FERAMs offer advantages of fast write speeds, high endurance and low operating voltage compared to EEPROMs and FLASH technologies. Present FERAM write speeds are approximately two orders of magnitude faster than FLASH and four orders of magnitude faster than EEPROMs. Further, operating voltages are less than 5 volts for FERAMs compared to 12 volt operation for FLASH and EEPROMs. Present FERAM technologies based on Pb(Zr,Ti)O3 (PZT) with oxide electrodes or SrBi2Ta2O9 (SBT) with Pt electrodes provide in excess of 1013 read/write cycles.
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