Patterning of organic, electronic devices using a high average power picosecond laser

Abstract

A picosecond pulsed laser has demonstrated successful selective ablation of different thin film layers from multilayer stacks on flexible substrates allowing structuring of large area flexible organic electronic devices. These thin film layers are extremely thin and sensitive to thermal damage, so the ultrashort pulse duration combined with the flexibility to use infrared, green and ultraviolet wavelengths allows clean scribing of a range of thin film materials used in organic, electronic devices. This capability combined with the high repetition rate allows high scribe speeds of several metres/second with little or no surface debris or heat affected zone. Such laser patterning is well suited for reel-to-reel processes offering the opportunity for cost effective production of flexible devices.A picosecond pulsed laser has demonstrated successful selective ablation of different thin film layers from multilayer stacks on flexible substrates allowing structuring of large area flexible organic electronic devices. These thin film layers are extremely thin and sensitive to thermal damage, so the ultrashort pulse duration combined with the flexibility to use infrared, green and ultraviolet wavelengths allows clean scribing of a range of thin film materials used in organic, electronic devices. This capability combined with the high repetition rate allows high scribe speeds of several metres/second with little or no surface debris or heat affected zone. Such laser patterning is well suited for reel-to-reel processes offering the opportunity for cost effective production of flexible devices.