Abstract

Microsensor packaging is one of the most important and challenging technology areas. Many microelectro-mechanical systems (MEMS) and optical MEMS (OMEMS) need to be protected from outside environment stresses: therefore the package must provide an interior environment compatible with the device operation, performances, reliability and lifetime. In addition some MEMS need a specific gas or pressure environment within the package to operate as specified: in particular, OMEMS should be protected against moisture related failures

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