Pattern transfer for diffractive and refractive microoptics

Abstract

Pattern transfer technologies developed for very large and ultra-large scale integrated (VLSI and ULSI) circuit processing can be adapted to fabricate high fidelity microstructures for planar diffractive and refractive optical elements (DOEs and ROEs). Lithographic, dry-etching, and material deposition techniques used to pattern continuous and stepped microoptical surface relief structures in dielectric, metallic, and semiconductor materials are reviewed. Examples are given of multilevel DOEs, analog refractive lenslet arrays, and subwavelength structures.