Abstract

This work presents the design, fabrication, and characterization of a printed radio frequency identification tag in the ultra-high frequency band with multiple sensing capabilities. This passive tag is directly screen printed on a cardboard box with the aim of monitoring the packaging conditions during the different stages of the supply chain. This tag includes a commercial force sensor and a printed opening detector. Hence, the force applied to the package can be measured as well as the opening of the box can be detected. The architecture presented is a passive single-chip RFID tag. An electronic switch has been implemented to be able to measure both sensor magnitudes in the same access without including a microcontroller or battery. Moreover, the chip used here integrates a temperature sensor and, therefore, this tag provides three different parameters in every reading.

Highlights

  • One emerging technology to control the supply chain is radio frequency identification (RFID)

  • In order to measure the vertical force applied to the packaging, we selected the FlexiForce A201 force sensor (Tekscan, Inc., South Boston, MA, USA) working in the force range up to 111 N (25 pounds)

  • Chip, whilst the necessary large inductive part is achieved with a surface mount device (SMD) inductor series 3650

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Summary

Introduction

One emerging technology to control the supply chain is radio frequency identification (RFID). The vast majority of RFID tags consist of an antenna and an integrated circuit (IC). Most RFID tags are low-cost passive tags, which take advantage of the reader-induced signal to supply power to the RFID chip [1]. In this sense, printed electronics results in a good alternative to produce low-cost systems in large-scale production. Several examples are found of RFID tags developed with different printing techniques such as screen printing, gravure, flexography, or inkjet printing [2,3,4,5]. In addition to cost savings, printed electronics can produce thin, wearable, and lightweight devices, as well as flexible systems by using malleable substrates [6]

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