Abstract

Purpose – The purpose of this paper is to present the latest results from research and development into future optical printed circuit board (OPCB) interconnects and low‐cost assembly methods.Design/methodology/approach – A novel method of high‐precision passive alignment and assembly to OPCBs was invented and a full evaluation platform developed to demonstrate the viability of this technique.Findings – The technique was successfully deployed to passively align and assemble a lens receptacle onto an embedded polymer waveguide array in an electro‐OPCB. The lens receptacle formed a critical part of a dual lens pluggable in‐plane connection interface between peripheral optical devices and an OPCB. A lateral in‐plane mechanical accuracy of ±2 μm has been measured using this technique.Research limitations/implications – As this is a free space optical coupling process, surface scattering at the exposed waveguide end facet was significant.Originality/value – This paper details a novel method of passively assemb...

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