Abstract
A new millimetre-wave passive and chipless packaged sensor for wireless pressure monitoring in harsh environment is proposed. This sensor uses a planar microstrip resonator coupled with a high resistivity silicon membrane. The remote interrogation of this sensor is performed from a Frequency-Modulated Continuous-Wave (FMCW) radar. Prototypes have been designed and fabricated using photoresist intermediate layer for the silicon membrane bonding. Pressure characterization of packaged sensor validate the transducer and packaging hermeticity. The sensor sensitivity is close to 2% per bar for the resonant frequency and the radar response is evaluated at 2 dB per bar.
Highlights
Wireless, batteryless and chipless sensors are a promising solution for the remote measurement of physical quantities in high radiation or extreme temperature environment or/and when the battery replacement is difficult or induces high costs
Electromagnetic sensors operating at millimetre-wave frequency range are good candidates and the authors have demonstrated the proof-of-concept from several transducers [1] using Frequency-Modulated
A 100 μm thick high resistivity silicon membrane is bonded over the resonator using low-loss photoresist (≅10 μm thick)
Summary
Batteryless and chipless (without electronic circuit) sensors are a promising solution for the remote measurement of physical quantities in high radiation or extreme temperature environment or/and when the battery replacement is difficult or induces high costs. A reading range up to 58 m of passive humidity sensors using a FMCW radar beam scanning technique was recently reported in [3]. This range is significantly higher than one achieved from wireless interrogation of passive RFID sensors (typically lower than 10 m). In this communication, the authors focus on a practical application case in which pressure is monitored in harsh environment. We can see that it is possible to reach a full-scale radar response up to 10 dB (Figure 3)
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