Abstract
We have found by infrared absorption that shallow acceptors in Si can be passivated throughout the bulk of a semiconductor sample several mm thick by annealing in H2 at high temperature (≳900 °C) and quenching to room temperature. The total number of shallow centers passivated in such samples is comparable to the number in highly doped surface layers passivated in a hydrogen plasma at lower temperature (typically <400 °C). The importance of bulk passivation techniques is discussed.
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