Abstract
Through wafer interconnects (TWI) with diameters greater than 50 mum have the advantage of extremely low contact resistances. The mechanics of the layers inside the TWI has to be well understood order to avoid passivation cracks. Results of simulation and mechanical investigations are discussed in this paper.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
