Abstract

Continuous miniaturisation of parts that have to be bonded especially in the electronic industry, have led to much higher stress requirements (percentage wise in terms of surface area) in the adhesive bond layer. The development of cyanoacrylate adhesive chemistry over the years has resulted in high static strength figures being achieved. Modern bonding techniques and assemblies however, have made this achievement largely irrelevant, as the performance of the adhesive joint under dynamic load conditions is much more important. Modern partly flexible adhesive grades give better results and open new areas of application for this type of adhesive, especially in plastic to plastic, plastic to metal as well as elastomer bonding applications.

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