Abstract

Optical directional couplers are the basic components of many optical information devices. The optical directional couplers based on silicon-on-insulator are very attractive due to the low power consumption, high transmission efficiency, and compatibility with complementary metal-oxide-semiconductor fabrication processes. However, the size of couplers designed by traditional ways could not meet the requirements of on-chip integrated optical systems. In this paper, two cross directional optical couplers on silicon-on-insulator are designed by a particle swarm optimized inverse-design method. Benefiting from the large optimization space, the footprint is as small as 2 × 2 μm2, which is much smaller than that of traditional devices. The simulation results show that the coupling efficiency of TE and TM directional couplers reaches 69.1% and 89.7% at 1550 nm, respectively. Both devices could operate in a broad wavelength range of 1480–1570 nm for TE and 1480–1605 nm for TM, and maintain over 60% transmission and over 20 dB crosstalk at the same time. This work may pave the way for ultra-small optical devices and on-chip photonic integrated circuits.

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