Abstract
Power inverters play a crucial role in converting DC voltage and current to AC voltage and current. Its efficient operation relies on effective thermal management of the semiconductor devices, such as the IRF 3205 MOSFET chip which facilitate the switching operations to prevent thermo-mechanical stress that could to failure. This research developed and optimize a heat sink for an IRF 3205 MOSFET chip in a 3.5 KVA power inverter, using the Particle Swarm Optimization technique and experimented with a 3.5 KVA 24 V power inverter operating a 1.5HP air-conditioning unit. The heat sink geometry has 26 fins, 4 mm fin thickness, 40 mm fin height, 3 mm fin spacing, 2 mm fin base thickness, 179 mm length, 80 mm width and a thermal resistance of 60.75 °C/W. The thermal performance was evaluated using ANSYS Computational Fluid Dynamics (CFD) and results showed maximum base temperature of 65.85°C and experimental temperature of 64°C after two hours of steady operation dissipating heat of 45W. The results from both numerical and experimental data demonstrate the effectiveness of the optimized heat sink in maintaining the chip's temperature below its maximum working threshold of 170°C.
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