Abstract
Transmission electron microscopy (TEM) has been used in an attempt to study the redispersion behavior of small platinum particles supported on flat, dense γ-alumina substrates. The alumina substrates were prepared both by anodizing and by sputtering techniques. A thin (1 to 2 nm) film of platinum was deposited onto these alumina substrates by sputtering. This film was subsequently transformed into discrete platinum particles by an initial heat treatment at 600 °C for 18 hr in air, and then “redispersed” by heating at 500 °C for 18 hr, also in an air atmosphere. Particle size measurements on TEM photomicrographs revealed no significant decrease in platinum particle size as a result of the “redispersion” heat treatment. These results are in contradiction to previous observations of platinum particle splitting under those conditions. The findings are discussed in the light of different concepts which have been used to explain redispersion phenomena.
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