Abstract

Metal Deposition or metallization process is one of the processes in fabricating a wafer. A wafer is a thin slice of semiconductor material, such as a silicon crystal, used in the fabrication of integrated circuits and other micro-devices. Due to the nature on the process, it creates lot of particles, which would impact the next process if it were not removed. Particle deposition on the wafer surface can cause the circuit to malfunction; leading to a loss of yield. Cleaning process needs to be done after metal deposition process in order to remove the particles

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