Abstract
This paper deals with the subsystem of yield management for semiconductor manufacturing. One of the major causes of defects in semiconductor products is the adherence of particles on the wafer, and reduction of such phenomena will be one of the most relevant policies to realize higher yield performance. Aiming to improve the yield of such products, this paper focuses on classifying the types of identification errors for each particle, and analyses the error characteristics of the current particle-monitoring/identification procedure through computer simulation. Further, a revised procedure is proposed to realize better identification performance.
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