Abstract
An investigation of the particle deposition velocity (vd) onto an upward moving 300 mm (dw) wafer in a cleanroom with a 0.3 m/s downward velocity (vo) was performed by the dynamic mesh model of FLUENT CFD code. The results show that the air simultaneously replenishes the vacant space induced by the movement of the wafer and new recirculation zones were formed around the wafer. These phenomena are apparently different from those of the wafer fixed (free-standing) in the flowing fluids. Compared with a free-standing wafer, the particle deposition velocity on a moving wafer was increased significantly. The deposition velocity increases with the increase of wafer moving velocity (vb). When the dimensionless moving velocity of the wafer Vb (= vb/vo) was 0.3, 1.0, and 3.3, the time averaged (over the dimensionless time τ (= tvo/dw) from 0 to 1.0) particle deposition velocity of particles with diameter of 0.1 μm was 11.4%, 20.8% and 37.8% greater than that of a free-standing wafer (vfs), respectively. In the computing range, the mean vd can be estimated by an equation of vd = vfs (0.208 Vb1/2 + 1.0).
Highlights
Deposition of particles on a surface is of great importance in many technological processes such as filtration, contamination control of microelectronic manufacture, control of surface fouling of microfluidic devices, and biofouling of artificial organs
This study aims to investigate the variation of the flow and particle deposition velocity on a upward-moving circular plate in downward air and particle field and to compare with the result predicted by the relative method, in which the upward-moving circular plate is treated as a stationary body in a flowing fluid
Since the moving velocity of the wafer was greater than the Vb = 0.3 case shown in Fig. 3, the variation of the flow field near the wafer is more drastic
Summary
Deposition of particles on a surface is of great importance in many technological processes such as filtration, contamination control of microelectronic manufacture, control of surface fouling of microfluidic devices, and biofouling of artificial organs. Deposition of submicron and micron particles from aerosol flow on a wafer surface is of special interest in semiconductor manufacturing. Many studies on this aspect for a freestanding wafer have been reported theoretically (Liu and Ahn, 1987), numerically (Oh et al, 1996; Schmidt et al, 1997; Yoo et al, 2004,), and experimentally (Ye et al, 1991; Opiolka et al, 1994,). There are many scenarios that particles are even easier to deposit on wafer when the wafer is moving in a flow field. Effect of flow field on particle deposition by wafer moving deserves detail investigation
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