Abstract
Particle adsorption behaviors on to metal lines during cleaning with a solvent containing ammonium fluoride (NH4F) were studied. In this experiment, a conventional batch spin wet tool was used for the cleaning process after dry etching of metal line patterning. Energy dispersive X-ray spectroscopy (EDX) analysis detected metallic particles showing a strong Cu signal (Cu particle) at the wafer center area, and also detected polymeric particles showing strong fluorine and carbon signals (FC particle) at the wafer edge area after solvent clean. Both types of particle were found on the metal lines. An isopropyl alcohol (IPA) rinse prevented the Cu particle growth, but enhanced the FC particle adsorption.
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