Abstract
Under certain conditions, with specified pressure and temperature profiles, bubbles of nanoscale sizes can be grown under or in close proximity to the nanoparticles being removed. This bubble growth can create a lifting force that exceeds the adhesive force between the particles and the surface. The basic cleaning cycle would consist of several stages. Once the pressure in the cleaning chamber drops below the saturated vapor pressure, the liquid becomes superheated, i.e. it starts to boil. Small (nanoscale) bubbles will be generated on particles and impurities, both on the surface of the wafer and inside the liquid. By operating with just a single parameter - pressure - we can make the bubbles grow, coalesce, and then extract particles from the wafer. The particle-removing forces to be discussed are expansion, resonant, drag, and flotation forces.
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