Abstract
A 2.5-D miniaturized substrate integrated electromagnetic bandgap (SI-EBG) is proposed for parallel plate cavity mode suppression for the low frequency microwave circuit packaging. The proposed 2.5-D SI-EBG unit cell consists of a circular patch and four via arrays. In this 2.5-D SI-EBG unit cell, via arrays are introduced to increase the capacitance and the inductance of the unit cell, which contributes to lower cavity mode suppression cutoff frequency. Dispersion diagram and mode analysis of the unit cell are given to explain its working mechanism. The electric size of the unit cell is reduced to 0.107l <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0</sub> × 0.107l <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0</sub> × 0.038l0, and its stopband fractional bandwidth (FBW) is 42%. Finally, an experimental prototype of such miniaturized SI-EBG packaging structure is fabricated by PCB technique for a microstrip meander line to demonstrate its cavity mode suppression performance.
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