Packaging using hot-embossing with a polymeric intermediate mould

Abstract

Hot embossing allows the high precision replication of features from a mould insert into thermoplastic materials. The technique has been developed mainly for microsystem applications, in particular, the manufacture of micro-optical and micro-fluidic components and systems. It can also be applied to packaging applications. We developed a specific process based on a two-step replication process utilizing hot embossing and a rigid polymeric intermediate mould, which allows the manufacture of complex three-dimensional shapes to realize a functional optical package for optical microsystems.