Abstract
Power devices are experiencing strong growth driven by demand in a variety of areas. Applications including energy generation and infrastructure, electric and hybrid vehicles, electric vehicle charging, datacenters, industrial automation, smart cities and buildings, home appliances, and transportation are driving demand for power devices. While many companies continue to expand production of silicon-based power devices, there is also demand for devices based on new wide band gap (WBG) materials such as silicon carbide (SiC) and gallium nitride (GaN). Driven by the need for increased power density and system efficiency, these WBG materials are being adopted in many applications and may require new packages, materials, and assembly methods. This presentation describes package trends and discusses some of the challenges faced.
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