Packaging in minimal fab: An integrated semiconductor line from wafer process to packaging process

Abstract

The minimal fab concept using a half inch wafer was proposed in order to achieve a small semiconductor factory which is free from huge investment and is suitable to low-volume production. As a part of the minimal fab, we have developed a novel packaging-line which realizes a manufacturing system seamlessly integrating a wafer process-line with a packaging-line. The minimal packaging-line employs the same local clean technology and device transport system as the wafer process-line. Wafer level packaging of the minimal fab is designed for enveloping and protecting electronic devices fabricated on a half inch (φ12.5mm) wafer. This paper describes the packaging technologies and equipment in the minimal fab.