Packaging for medical and wellness applications

Abstract

Abstract Wellness and medical area are today identified among the next big markets, and the associated roadmaps show a global trend from the benchtop to portable devices then to longer term wearable and implantable devices. For these last devices new packaging technologies need to be developed in order to satisfy both size reduction, important reliability constraints, and moderate/low costs. Two divergent identified markets have been identified:-Consumerist healthcare market associated to high volume and low cost manufacturing,-Professional healthcare market associated to low volume and high cost manufacturing. Based on these findings, we will present in this paper the main new packaging technologies developed at Léti to fit with the constraints of these markets:-In the field of wearable devices: an innovative package designed to be integrated in textiles offering low interaction with material structure and compatible with standard textile tooling and package-winding machines. A specific example of RFID tags will be presented.-In the field of implantable devices: an advanced implantable low profile silicon box for SiP including a MEMS chip and its ASIC. The emphasis will be put on the tests needed to satisfy the different constraints linked to implantability (biostability, biocompatibility).-Lastly, some generic building blocks for soft packaging will be presented, as well as the main trends in their use.