Abstract
Packaging of distributed feedback (DFB) laser array based on reconstruction-equivalent-chirp (REC) technology is a bridge from chip to system, and influences the practical process of REC chip. In this paper, DFB laser arrays of 4-channel @1310nm and 8-channel @1550nm are packaged. Our experimental results show that both these laser arrays have uniform wavelength spacing and larger than 35dB average Side Mode Suppression Ratio (SMSR). When I=35mA, we obtain the total output power of 1mW for 4-channel @1310nm, and 227μw for 8-channel @1550nm respectively. The high frequency characteristics of the packaged chips are also obtained, and the requirements for 4×10G or even 8×10G systems can be reached. Our results demonstrate the practical and low cost performance of REC technology and indicate its potential in the future fiber-to-the-home (FTTH) application.
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