Packaging and Integration Concept for High-Performance and Cost-effective IQM-based Transmitter Module for 160 Gb/s Applications

Abstract

Photonic packaging and interconnection design of Polarization Multiplexed RZ-DQPSK format are actually gaining interests because of the urgent need to fit 100+ Gbit/s channels into existing DWDM systems, with the associated advantage to use driving electronics at the effective speed-rate needed for each driving port. However, packaging and integration of IQM (In-phase/Quadrature Modulator) chips for 100+Gb/s applications poses huge design and process challenges. In this contribution, we present a systematic concept for efficient and cost-effective packaging and integration of a 4 × 43 Gb/s Polmux RZ-DQPSK transmitter module for 160 Gb/s applications. This concept takes into consideration electrical and thermo-mechanical design challenges right at the beginning of the design cycle, so as to prevent any system failure or possible re-designs. The two InP IQM chips are flip-chip bonded on a BGA-based ceramic package, preserving signal integrity, simplifying routing and dramatically minimizing overall size and assembly costs.