Abstract
This paper presents the design of 50ohm microstrip line, modelling of the metal ceramic package, packaging and characterization of a GaAs MMIC die in the metal ceramic package with optimised interconnections and validation of its performance parameters. The packaged MMIC was characterized under various environmental conditions like temperature cycling, burn-in test and life tests at as per MIL-STD 883 standard. The MMIC performance was monitored before and after every test condition. The packaged amplifier MMIC resulted in good input /output return losses (better than 17dB), linear gain of 20dB, gain flatness of less than 0.5dB, P1dB of 12dBm. It has shown very low drift in gain of plus/minus 0.22dB against 1dB and variation of 1percent in Ids against 10percent.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
