Abstract
This paper addresses the various types of surface mounted packages used today for high‐density packaging of Very Large Scale Integrated devices. The paper discusses the pros and cons of both the leaded and leadless package, and provides the reader with general guidelines for their use.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
