Abstract
This paper presents the design of on-chip micro-antennas for package-scale galvanic isolators based on RF planar coupling. A step-by-step design procedure is proposed, which aims at the maximization of the weak electromagnetic coupling between the RX and TX antennas integrated on side-by-side co-packaged chips to enable both high isolation rating and common-mode transient immunity thanks to the high dielectric strength and low capacitive parasitics of a molding compound-based galvanic barrier, respectively. Micro-antenna design guidelines are drawn, highlighting the main relationship between coil coupling performance and their layout parameters, which are often in contrast with respect to traditional integrated inductor ones.
Highlights
Galvanic Isolators Based on RF Planar CouplingThis Section gives an overview of the main characteristics of a galvanic isolator based on a package-scale barrier, highlighting main advantages with respect to traditional chipscale implementation
Dipartimento di Ingegneria Elettrica Elettronica e Informatica (DIEEI), University of Catania, Abstract: This paper presents the design of on-chip micro-antennas for package-scale galvanic isolators based on RF planar coupling
A promising approach is represented by the package-scale isolation, which consists in building up Keywords: common-mode transient immunity (CMTI); electromagnetic coupling; galvanic isolation arating; galvanically isolated system by using standard packaging/assembling techniques along on-chip antennas; package; radio frequency; tapered spiral with radiofrequency (RF) coupling between two on-chip micro-antennas
Summary
This Section gives an overview of the main characteristics of a galvanic isolator based on a package-scale barrier, highlighting main advantages with respect to traditional chipscale implementation. The overall fabrication costs are the result of a complex combination of silicon and package costs, but typically a silicon-integrated isolation barrier is more expensive than a stand-alone post-processed polyamide one In any case, both approaches are highly limited in terms of CMTI performance due to the relatively low distance trough insulator (DTI), which is in the order of tens of microns. In this approach, the DTI must be chosen to guarantee the required isolation rating, ensuring at the same time a reasonable coupling level between the micro-antennas.
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