Abstract
A package-on-package configuration was designed and assembled to replicate an off-the-shelf RF device to reduce its footprint, height and thus volume. The footprint was reduced by 60% and the height was reduced by 32% resulting in 73% reduction in volume. An efficient assembly process was developed using information form electrical, thermal and mechanical simulations.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have