Package-Level Integrated Antennas Based on LTCC Technology

Abstract

We propose a novel package topology integrating multilayer miniaturized antennas. Such a functional package is suitable for the design of a system-on-chip device, or of system-on-package applications. A stacked patch antenna is designed and integrated in a package using a low temperature co-fired ceramic process. The overall size of the package is 10.3/spl times/10.3/spl times/1.3 mm/sup 3/, and this package contains an 8.3/spl times/8.3/spl times/0.7 mm/sup 3/ internal space for the integration of chip-scale packaged components. The package is mounted on a 20/spl times/20 mm/sup 2/ ground plane to miniaturize the volume of the system. The antenna is designed to have two neighboring resonant frequencies at 5.264 and 5.355 GHz, resulting in a 140 MHz impedance bandwidth. However, the measured resonant frequencies occur at slightly higher frequencies due to manufacturing tolerances. Radiation patterns are similar to a conventional patch antenna. In addition, various parasitic effects rooted in the package size, ground size, antenna height, SMA connector, via misalignment, and the number of via holes and their locations are fully investigated.