Abstract
This paper reports our developments for Micro LED laser lift‐off which is a very important step in Micro LED mass transfer process. By selecting the temporary bonding material, optimizing laser power intensity, and using PSS structure, the yield of Micro LED laser lift‐off can reach 99% for more than 5000 LEDs. This technical developments is of great potential for promoting high‐yield mass transfer technology to realize commercial Micro‐LED displays.
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