Abstract
The deposition of thick Cu films on large glass substrates, for instance G8.5 and G10.5 is challenging but essential for large size and 8k TV sets. The inevitable temperature rising during metal deposition results in a series of severe issues such as film oxidation and glass bending, which have been seldom investigated. In the paper, the process issues leading by thick Cu film deposition have been disclosed and solutions have been discussed. Film properties as surface roughness, grain size and electrical resistivity have been characterized and the results will help improve the performance of thick Cu wires.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
