P2H-5 Small 3x2.5mm² Sized Surface Acoustic Wave Duplexer for US-PCS with Excellent Temperature and Frequency Characteristics

Abstract

Using flattened-SiO2/Cu-electrode/36~48deg LiTaO3 structure, small size (5 x5mm2) surface acoustic wave (SAW) duplexer with a good temperature coefficient of frequency (TCF) for US-PCS was realized by authors. However, a smaller duplexer has been strongly required. Using flip-chip bonding process of SAW chips and Rayleigh SAW propagating on the flattened-SiO2/Cu- electrode/126~128degYX-LiNbO3, which has larger cou pling factor than above-mentioned substrate, a smaller sized (3x2.5mm2) SAW duplexer with a good TCF has been realized.