Abstract
AbstractP‐substrate AlGaInAs/InP lasers are enabled using an internal carbon‐doped layer to block Zn‐diffusion. These inverted lasers are developed for the aim of further monolithic vertical integration with passive or active material, which would allow full system on‐chip integration. The lasers emit at 1.5 μm making them ideal for telecommunication applications. Different p‐substrate laser designs were grown to quantify the effect the carbon doped layer had on blocking Zn p‐dopants diffusion, which permits the long growths necessary for vertical integration. Current, voltage, and capacitance measurements were used to examine the different laser designs, proving that Zn p‐dopant diffusion is responsible for p‐substrate laser failure.
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