Abstract
The FEA(Finite Element Analysis) is used to study the optimization of the teardrop shape and stack‐up DOE. We use the viscoelastic model to optimize the teardrop shape parameter: the angle a and the arc‐radius r,. We studied Stack‐up optimization by changing the OCA modulus to reduce the risk of cohesion failure. An 8.0inch teardrop shape foldable AMOLED display prototype was fabricated with a bending radius R=1.5mm.
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