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Abstract
AbstractIn flexible display fabrication, removing the flexible substrate from the rigid carrier glass, without damaging the OLED or the TFT devices, is considered difficult. This particular manufacturing process is referred to as the de‐bonding process. This report provides a simple method to attain a de‐bonding layer which can be applied in a very high temperature process over 450°C. The range of peeling force after the array process can be adapted from 4 to 20 gf.
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