Abstract
Presented here are the fabrication techniques for preparing micro scale and ultra‐thin LEDs for micro‐LED display applications. Lateral dimension less than 100µm and thickness of 5µm LED devices are fabrication and the preparing micro LEDs are transferred from the original growth substrate to the glass substrate successfully. The optoelectronic performance of micro scale and ultra‐thin LEDs transferred on to the glass substrate as good as that of on the original growth substrate has achieved.
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